Laser Glass Processing Machine
- Drillable hole size 50 µm to 50 mm
- Substrate thickness from 50 µm to 8 mm
- Drilling speed up to 30 mm/s (0.5 mm glass)
- Scribing/marking speed up to 2000 mm/s
- Tolerance: < 50 µm
- Standalone and in-line system
- Customized laser solution available for various applications
Applications
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Laser glass cutting, drilling and marking (soda lime, borosilicate, fused silica, and more)
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Laser thin film patterning (TCO, metal, and more)
2700 E. Bilby Rd.,
Tucson, AZ 85706, USA
Tel: +1.520.790.5468
Fax: +1.520.790.1158
E-mail: contact@advaluephotonics.com
Sales: sales@advaluephotonics.com
Human Resources: hr@advaluephotonics.com